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Letter 29024
Solder Plating on Mold Compound Resin
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Hi there,
I am a QC engineer, recently we had encounter some issue on the
solder flakes on mold compound surface just at the edges of the lead.
This problem is detected after plating process and from the solder
appearance the solder appears to be plated on the mold compound
surface.
I would like to know if any members had such experience of this
trouble and what were the probable causes for this issue.
ERIC HO
IC assembly - SINGAPORE
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Does the word 'lead' in your question rhyme with beed or bed? I
think you are saying that you are plating the leads of resistors or
ceramic capacitors or something like that, and the solder plating is
creeping away from the metal leads (on leaded, rather than surface
mount components) and plating onto the ceramic area? Is this an
MSA-based solder plating?
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Ted Mooney, P.E.
finishing.com
Brick, New Jersey
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Hi Ted,
Yes you are right about the solder plating creeping away from the
lead edges and onto the package surface (QFP). We were wondering if
this cause could relate to the package surface being ionised or had
conductive material under it.
Eric Ho
- Singapore
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Is there any update for this issue? Currently having this problem
once a while. Suspecting the sludge in the plating tank that cause
the problem
Jason Choo
- Singapore
Dear Reader, please --
- Answer or follow-up on this subject (in non-commercial
fashion).
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- Post a new
question or inquiry on a different subject.
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