Letter 29024

Solder Plating on Mold Compound Resin  

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Hi there,

I am a QC engineer, recently we had encounter some issue on the solder flakes on mold compound surface just at the edges of the lead. This problem is detected after plating process and from the solder appearance the solder appears to be plated on the mold compound surface.

I would like to know if any members had such experience of this trouble and what were the probable causes for this issue.

ERIC HO
IC assembly - SINGAPORE

Does the word 'lead' in your question rhyme with beed or bed? I think you are saying that you are plating the leads of resistors or ceramic capacitors or something like that, and the solder plating is creeping away from the metal leads (on leaded, rather than surface mount components) and plating onto the ceramic area? Is this an MSA-based solder plating?

Ted Mooney, P.E.  finishing.com Brick, New Jersey

Hi Ted,

Yes you are right about the solder plating creeping away from the lead edges and onto the package surface (QFP). We were wondering if this cause could relate to the package surface being ionised or had conductive material under it.

Eric Ho
- Singapore

Is there any update for this issue? Currently having this problem once a while. Suspecting the sludge in the plating tank that cause the problem

Jason Choo
- Singapore

Answer or follow-up on this subject (in non-commercial fashion).

 

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