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Cleaning bond areas of nickel/silver plated lead frames

My company's electronics division is testing a set of new die attach materials suitable for use on metal lead frames that are typically alloy 42 or a copper alloy, plated with nickel/silver in the bond areas. We need a recommendation on how to clean the bond area before dispensing the adhesive. We test adhesive strength after exposure to JEDEC conditioning steps. Is an alcohol wipe sufficient or does the silver require some cleaning to remove oxidation (as copper would)? The lead frames are used in TSOP and QFP types of packages as well as power components. Plasma cleaning is also an option as most of our customers have that capability (used before wirebonding and overmolding steps).

Thomas Noll
applications engineer - Midland, Michigan
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