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Letter 24079
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Trevor Crichton |
Trevor's observations are correct. The most likely cause though is that there is a loss of electrical current or electrical contact during the plating process. This would lead to the nickel deposit becoming "passive" and any consequent nickel deposition would not be fully adherent.
Joseph Garner
trade platers - Corby, Northamptonshire, England, U.K.
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+++++ Actually I have working in semiconductor's company, I have many doubts in this fields, so you please consider my questions & cleared it , my question's is 1) what is meant by peeling ,and how we have to find out this 2)what is meant by blistering 3) what is meant by uneven, and how we have to find out this. Lakshmanan Chandra
Mohan
October 17, 2009 Hi, Lakshmanan. Blistering of plating is called blistering because it is very similar to blistering of human skin; it's a separation of the outer skin from the body of the part. It is a precursor to peeling, because the plating has peeled away from the substrate, but until the blister breaks, you don't see the substrate. "Uneven" has no specific meaning in plating; look up synonyms in a dictionary or a thesaurus and you will understand. Good luck. Regards,
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