Letter 24078

Removal of copper contamination from MSA based tin-lead plating solution  

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Is there a way or method to remove or reduce copper ions in SnPb or pure Sn plating baths (MSA based)? Except plating it out at high current density?

Gilman Jimenez
semiconductors - Calamba, Laguna, Philippines

Kumusta na kayoo, Forget it Paray, dump the bath and start over before the solder starts voiding during solderability test after steam age. With SnPb MSA baths its good to use two baths, one for striking and one for plating since the strike will get loaded up with Cu if you are not Ni plating prior. Then just routinely dump the cheap strike.

Dave Kinghorn      Chemical Engineer SUNNYvale, California