Letter 23691

Under coating clarification  

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Dear Sir,

We do the connectors for Telecom application. At present we are doing Nickel as a under coat & silver as a top coat with minimum five microns for connector terminals. We would like to know, for under coat application, which one is superior ( Nickle OR Copper ) in tems product reliability & other techinical issues? Could u please suggest some refernce books for this subjects. Also what is the the minimum thickness we have to maintain in both cases?

With Regards,

Mohan. G.
communications company - Bangalore, Karnataka, India

Hi, Mohan. Copper is no good. The nickel plating preserves solderability and acts as a barrier against diffusion. We have an on-line article here by Paul Stransky which may offer some help on your barrier layer plating questions. Good luck.

Ted Mooney, P.E.  finishing.com Brick, New Jersey

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