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Letter 23007
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Asif Nurie |
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It is possible that the preparation for acid copper plating does not remove all the soils. Anything left on the surface may cause pitting. I suggest an experiment: Wet sand a panel using 600 grit emery, rinse, acid dip, D.I. rinse and plate in the acid copper bath. Sanding should remove the type of imperfections that cause pitting. If no pitting, reevaluate your entire cleaning and preparation cycle. Look especially for traces of photo resist or other resist residues.
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One additional thing to consider is excessive resistance between your anode + cathode. If your anode bags or diaphragm between your anode and cathode is too tight a mesh or if it is sludged up (plugged), you simulate a set- up with insoluble anodes. Have you tried switching one of your "good" baths into your "bad" tank?? Does the problem stay with the tank or move with the bath? That would also help your trouble shooting.
Bob Edwards
- Endicott, New York
We fixed a similar problem where I last worked by replacing the cleaner bath. When it reaches it's end of life, it does not remove resist residues completely which creates sites for bubble formation.
John Nelson
- Leesburg, Virginia
Maybe imperfectly filtration. If you use filter paper ,you will find carbon. I sometimes find such thing in our customer bath. Of course, They have no any other problem.
SE DO JANG
- korea
Dear Sanai,
I recommend you to please concentrate on the etching and activation
of the PCB, including electroless Ni or Cu whatever you are coating.
Concentrate also on Degreasing, Antipit concentration, filtration and
agitation.
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Shafiuddin A. Mohammed |

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