Letter 2012

Electroless copper plating adhesion

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I need help on a problem-
I am developing an epoxy based material that the customer wants to copper plate with electroless copper. The dilemma is in how to improve adhesion of the e-copper to the epoxy material.

Please send suggestions for improving electroless copper adhesion to epoxy to:

David Zoba
Dexter Electronic Materials

David,

A couple of things come to mind with epoxy that could give you some micro-roughness. Plasma treatment is one, the other is chemical attack, there are several acids that would do this.

What kind of peel strengths are you getting now ?

Paul Stransky
Paul D. Stransky Associates

Dear Sir

I am intereted in your an epoxy based material on electroless copper plating technology. please send me infomation. thank you Sung-Ryoung LIM

Sung-Ryoung Lim
SRTECH CO., LTD. - 2ra203 shihwa industrial complex, jungwang-dong shiheung-si, kyunggi-do, 429-450,Korea

How do you test the peel strength? I'm also involved in electroless (nickel) on an epoxy/carbon fiber substrate. My parts are cylindrical.

Thanks,

Alan Kirkpatrick
- Shelburne, Vermont, USA

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