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Delamination

We face problem regarding delamination between Copper (partial copper striking process) & nickel (full nickel plating process) during peeling test. In between this two process, normal DI-water rinsing provided. Is it OK? Shall we need any chemical flushing needed?

The passivity breakdown for Nickel surface cause copper delamination? Why cause it? Chloride ion attack? Temperature? Chemical concentration?

Internal stress is the problem for delamination? We conduct heating sample to 400 °C ( 5 min ), bending test follow tape peeling test. We encounter delamination also. ( All using new fresh sol'n)

For Copper strike, if we increase Dk will help for prevent delamination? Current thickness: Ni~ 2 µm ; Cu ~ 0.16 um.

Thanks for helps.

LOH Kok Yong
- Singapore
2002

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