Letter 1046

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I am looking for any papers or other research that has been performed on the examination of the microstructure of electroplated bronze.

Specifically, I am looking for the mechanisms of intermetallic formation, and how to avoid the formation of the low melting point intermetallics in electroplating bronze.

Thanks...Louis

Louis Morin - Westaim


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I am not sure whether you are talking about electroplating of copper-tin alloys (bronze) onto other substrates or plating other metals onto bronze substrates. Your question would be easier to answer if we knew specifically what plating materials onto what substrate materials you are interested in.

There are numerous references for the formation of intermetallics when tin and other metals are electroplated on to copper alloys. Most of this work is related to solderability problems in the electronics industries. Intermetallics inhibit solderability due to their high melting temperatures. Low melting temperatures are typically due to eutectic compositions of alloying elements.

Let me know what alloys you are interested in, and I will respond with some references.

Larry Hanke
materials testing laboratory
Minneapolis, Minnesota


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Look in Brenners Electrodeposition of Alloys. He talks about microstructure of bronze electroplated coatings. Chances are you will have to find the books at a local university library. Also try Safranek's book available through AESF.

Tom Sivula - SurfaceTek

Ed. note 12/20/04:
As of this date, one copy each of Brenner's "Electrodeposition of Alloys" was available from this link at Alibris icon, and from this link on Abebooks.
 
Used copies of Safranek's "Properties of Electrodeposited Metals and Alloys" are available from this link at Abebooks


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