Letter 5056

Nonwet/ dewet  

.

I am having problem with solderability, non wet and dewet. The lead frame material was alloy 42. I am new in this process and trying to figure out what is the cause of dewet or nonwet.

Below are the process :-

- lead frame was subject to high temp 435 deg C

- pre-clean and 100% tin plated ( rack)

- subject to oven burn-in at 150 deg for 84 hours.

- hot solder dip - this is where I have problem.

* Need advise on what is the possible root cause.

* What do I need to look for ?

* What sort of test that I need to do ?.<?P>

Koh Heng Lim
- Singapore

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