HOME FAQs BOOKS JOBS: Help Wanted Suggestions      you are here: Hotline/Forum => Letter 4060

---

Blistering after 2nd layer of Electroless Nickel

-

HELLO,I AM HAVING PROBLEM WITH BLISTERS IN THE CAVITY OF THE PARTS AFTER PUTTING 100 MICROINCH OF ELECTROLESS NI. I TRIED TO PLATE IT TWICE WITH SINTER IN BETWEEN TO SLOW THE NI DEPOSIT BUT I AM STILL GETTING BLISTER AFTER 2ND PLATE. ANY HELP OR ADVICE WILL BE GREATLY APPRECIATED.

THANX IN ADVANCE.

A LITTLE INFO:

• MATERIAL IS COPPER TUNGSTEN

NOLI BERLING
- San Diego, California

---

-

please help! our customer is not happy with the rough finish on the parts due to sandblasting.

we tried baking soda blast but we are getting blister after 2nd E'less. is there any other process that we can use to eliminate sandblasting without blistering the parts? or is there any sandblasting media that does not leave a rough finish that are easy to clean?

material is copper tungsten

process

1 e'less

2 sinter

3 sandblast

4 e'less

5 electrolytic

6 sinter

spec calls for 100 microinch of ni with electrolytic ni on top.

NOLI BERLING
- San Diego, California

---

.

Tungsten Carbide is difficult to plate on. You need special pretreatment for that.

Thick EN should also be a special EN. Not all EN processes can plate thick deposits. Consult your supplier.

I am not familiar with the sintering that you mentioned but you cannot plate EN on EN without electrolytic activation in between as it will peel off.

Sara Michaeli     chemical process supplier Israel