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Letter 38047
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Trevor Crichton |
One potential advantage of horizontal plating is partial submersion so that you can measure the plating thickness and spot some gross defects as the plating is progressing.
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Neel,
I read the Trevor and Ted's answer, they are good, but I would like
you know some practical points for this problem.
At first, There are some different between this two procedure base on
cr(VI)plating,I can guess how do you it, but i don't know your
equipment level. If i assume your solution was refined and with a
normal condition,
1-Did you could balance the temperature between bottom and top of the
bath during your plating? for this tank ,it's more important to
getting a good result in the vertical and with this deep.
Did you have a fixture for prevent of 'near the anodes with the
shaft' at the bottom of tank or another mechanism for this?
3-At this vertical procedure,you had anodes about 3.5 meter minimum,
did your anodes were clean at the all of these surface (for example
at the end of it).
Rgds;
Hamed Shams
- Karaj, Iran
Neel:
Based on the answers you have received and the absence of this
problem on the Internet.......I can only conclude the parts can be
plated vertically without taper. With a single connection at the top
we had the same problem and after checking everything we concluded
the taper was due to voltage drop and thus less current density from
top to bottom. However....like you we are not certain. Copper core
anodes possibly help but resistance in the part is still present with
no practical way of multiple connections..
Can't see horizontal improving taper except anode current
distribution potentially improved.
I hope we hear more on this.
Cliff Smith
Cliff Smith
- Oklahoma City, Oklahoma

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