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Tin electroplating

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I need to get a layer of tin onto a pure lead electrode. I am a materials scientist and have a theoretical understanding of electoplating but have never performed the technique. I was hoping you could tell me the chemicals, concentrations, and current/potential processes to use to accomplish this task. I am assuming that I can modify the amount of tin deposited by varying the time. I have read about some of the differenct chemicals to utilize (tin sulfate vs. tin fluoborate) and am not sure which to use nor, which organic additives to utilize. Thanks for your help.

Best Regards,

Nicholas Brazis
electrochemistry - Bloomington, Illinois

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Clean the lead in an alkali to remove orgnic soil, rinse, dip in 50% fluoboric acid for 2 minutes, rinse, electroplate in a tin fluoboric acid solution, rinse, dry.

The tin sulfate system will form insoluble lead compounds in contact with the sulfate and there will be no adhesion.

Robert H Probert Robert H Probert Technical Services Garner, North Carolina Editor's note:        Mr. Probert is the    author of Aluminum How-To / Aluminio El Como

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Dear Nicholas,

I recommend to contact a plating chemical supplier, such as Enthone-OMI. They should have tin plating process for different applications.

Regards,

Dominik Michalek
- Mexico City, Mexico