Letter 33096

Adhesion problem of plated gold  

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After deposition (thermal evaporation) of 2500A chrome + gold , we are plating it to 4 micron thickness using gold potassium cynide salt in an electrolytic cell with a pulsed supply. The problem is that the gold when it reaches 4 micron thicness does not adhere well with the sapphire substrate. Any suggestions for improving the adhesion.

Vanya Srivastav
SSPL, Semiconductors - Delhi, India

What are your plating and pretreatment processes? No-one can advise you if they don't know what you are doing.

Trevor Crichton R&D practical scientist - UK

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