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Problem with tin plating-like mechanism on silicium

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We have a high level of potassium stannate in the hydrogen peroxide we use for cleaning our wafers. We've detected some Sn contamination on the surface in highly implanted zone. As an ex-plating guy (electroless gold and nickel) I'm wondering if this could be caused by a plating-like mechanism since I've learned potassium stannate is used as an electrolyte for tin plating bath. Haes anyone heard of a similar problem? Can tin can lightly plate on phosphorus or boron implanted silicium? Anyone got good resources about tin plating with potassium stannate?

Thanks

Pascal Boivin
semiconductor manufacturing - Bromont, Quebec, Canada

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