Letter 31014

Multi plating of Kovar for soldering  

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One of our customers is requesting a change in plating to a Kovar strip which is soldered to a silicon solar cell. They have ask for Nickel strike 0.00003", then Copper plate to 0.00005 to 0.00015 thick, followed by a silver plate, type I, grade B to 0.00008 to 0.00012. Finally a solder plate 0.0002 to 0.0003 which is then fused. Does anyone have experience of this sequence of plating, with the advantages and dis-advantages?

Thanks in advance.

John Hughes
electronics - Hawthorne, CA, USA

Advantages and disadvantages compared to what, John? You didn't say what you presently have experience in. I'm not a solder expert, but the step where you solder plate on top of the silver silver doesn't sound right to me, and all of the layers sound a bit thin.

Ted Mooney, P.E.  finishing.com Brick, New Jersey

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