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Letter 30010
Selective copper etchant
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I have the following question:
I have one microstructure which is composed of one layer of
Ni(95%)/Fe(5%) (thickness: 350µm) and one layer of Cu
(15µm). I would like to etch selectively the copper; the Ni/Fe
should be not attacked. Do you know some etching solutions ding this
? What is the process ?
I'll read that the sample should be totally clean and that the
parts should be wet (why)?
Thank you very much in advance.
Pascal MEYER
Electroplating and etching - Karlsruhe, Baden-Wurtemberg, Germany
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You can use next solution:
210 gm natrium sulphide
15 gm sulphur
20 C temp. (according to Praktische galvanotechnik,Saulgau 1997.)
Goran Budija
- Zagreb, Croatia
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You may want to look at US Patent 5,304,284 (Jagannathan et al). A
working formulation based on this patent is isopropanol or ethanol
based, with added 2-butene-1,4- diol, triethylorthoformate, and
copper tetrafluoroborate (I don't recall the exact ratios). I used it
successfully on structures containing copper and NiFe alloys. Of
course any non-R&D use probably requires licensing.
Emanuel I. Cooper
- Yorktown Heights, New York
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