Letter 28025

How to shorten the plating time for acid copper  

++++

Hello,

I am a beginner in electroplating and in need of information about shorten the time of acid based copper plating. The following is the current setting: ANODE: copper nuggets (fully immersed in the tank), CATHODE: Steel base cylinder that has been previously coated with Nickel (half immersed in the tank and rotating at certain speed).

ELECTROLYTE: CuSO4, H2SO4, and additive dosing.
SETTING: I set the current density at 22 A/dm2.
Average plating time = 120 - 200 min.

I have tried to increase the current density to 25, but it resulted in roughness on the cylinder surface. Same thing happen as i increased the temperature. I have tried other paramaters as well, but nothing seems to shorten the plating time (maybe decrease it to 60 - 70 min??), so i am wondering if anybody have any clue? Thx in advance!

Fedrick Tanuddin
Student - Jakarta, Java, Indonesia

This answer is so obvious that there must be a reason why you're not doing it: fully submerge the cylinder rather than half submersing it.

Ted Mooney, P.E.  finishing.com Brick, New Jersey

Answer or follow-up on this subject (in non-commercial fashion).

 

Post a new question or inquiry on a different subject.