HOME FAQs BOOKS JOBS: Help Wanted Suggestions you are here: Hotline/Forum => Letter 28025

How to shorten the plating time for acid copper

++++

Hello,

I am a beginner in electroplating and in need of information about shorten the time of acid based copper plating. The following is the current setting: ANODE: copper nuggets (fully immersed in the tank), CATHODE: Steel base cylinder that has been previously coated with Nickel (half immersed in the tank and rotating at certain speed).

ELECTROLYTE: CuSO4, H2SO4, and additive dosing.
SETTING: I set the current density at 22 A/dm2.
Average plating time = 120 - 200 min.

I have tried to increase the current density to 25, but it resulted in roughness on the cylinder surface. Same thing happen as I increased the temperature. I have tried other paramaters as well, but nothing seems to shorten the plating time (maybe decrease it to 60 - 70 min?), so I am wondering if anybody have any clue? Thx in advance!

Fedrick Tanuddin
Student - Jakarta, Java, Indonesia

++++

This answer is so obvious that there must be a reason why you're not doing it: fully submerge the cylinder rather than half submersing it.

Ted Mooney, P.E.
finishing.com
Brick, New Jersey

ANSWER or FOLLOW UP POST an unrelated QUESTION HOT Topics

Disclaimer: It is not possible to diagnose a finishing problem or the hazards of an operation via these pages. All information
presented is for general reference and does not represent a professional opinion nor the policy of an author's employer. The
internet is largely anonymous; some names may be fictitious and some recommendations may be deliberately harmful.

If you are seeking a product or service related to metal finishing, please check these Directories: