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Letter 23047
How to reduce paint thickness in cathodic
Electrodeposition system?
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+++
I'm working on a cathodic electrodeposition (CED)
project. Currently I'm getting paint thickness in the range
of 25-32 microns.I want to reduce this thickness up to 18-20
microns. CED bath parameters :: pH 5.90-6.10 Conductivity
960 micro siemens. Temp 28-30 degree Celsius NVM(% solids)
9.43 % P/B (pigment binder ratio) 0.10 Voltage 160 V Anolyte
conductivity 2500 micro Siemens I have three ways to reduce
the thickness .
a. By reducing the bath conductivity
b. By reducing the anolyte conductivity.
c. By reducing the NVM.
d By reducing the voltage/current.
e. By reducing the dipping time in CED bath.
I cant reduce the dipping time in bath as i have some
restriction. I cant reduce the anolyte conductivity as on
reducing this fungus/bacterial growth is taking place. I
cant reduce the NVM as it is already on lower side (standard
is 12-14 %). My bath conductivity is already on lower side
but still thickness is not coming low. I'm operating at 140
V though my standard is of 250-300 V. Please suggest me how
can i reduce the thickness.
Manish C [name deleted for
privacy]
- New Delhi, New Delhi, India
First of two simultaneous responses -- +++
Manish,
Please check the pH is per your supplier's standard.
Please check that the conductivity conforms to prescribed
levels per supplier data sheet. Are you running an
Ultrafilter and replacing the discharged permeate with DI
water of 5 micro siemen conductivity. Are the solids as
prescribed.
Since we do not have an idea of the proprietary process
you are using, some of these suggestions may validate the
process. Hope this helps.
Regards,
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Second of two simultaneous responses -- +++
I have used electrophoretic paint in the past and found that the
thickness of the cathodic electrodeposit could be controlled by
either the temperature or the voltage. Changing the bath chemistry is
not a wise way to proceed because you are altering an established
system and unless you know exactly what you are doing, you will cause
a lot of future problems. The deposition thickness is related to the
bath temperature, so by reducing this and keeping all other
properties constant you will reduce the thickness. The systems I have
worked on are quiet sensitive to temperature, so only modest changes
will alter the thickness. Alternatively, reduce the voltage; this
will also reduce the thickness. I do not know what you mean by
operating at 140 V although the "standard is 250-300 V", so perhaps
you can elucidate. Finally, if these two changes do not reduce the
thickness to your needs, you have to reduce the processing time.
Assuming your system is similar to the one I have used, there is no
point in reducing the current because this automatically reduces to a
very low value as the deposit thickens.
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Trevor Crichton
R&D practical scientist - UK
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+++
Dear Asif ,
Thx for ur valuable suggestions. I m running the ultrafiltration
unit and also using DI water of < 5 microsiemens conductivity. pH
is in the supplier's range(5.10-6.10).but still I'm not able to
reduce the thickness. I'm working with the latest CED technology .
Our system is a latest one. We have four ways to reduce the thickness
in CED system and which I have described in my previous query and I
have tried all except reduction in dipping time. I can't go for this
option. I hope that you will further give ur valuable suggestions to
me.
Thanking you.
Dear Trevor,
Thx for ur valuable suggestions. Yes I am using the same system
what u r using there. I am using the latest CED system which is used
everywhere in this world. So assume that its the same as u have. Yes
its true that standard voltage requirement is 230-250 volts but I'm
operating at 160 V bcoz I thought it will help me in reducing the
thickness. It's also true that my trial can damage our system and can
create future problems but I love to do trial bcoz without trial we
can not come to a conclusion.
As far as temperature is concerned our standard is 28-30 Degree
Celsius and I have reduced it to 27 from 30 but still the thickness
is coming high and I am surprised that at lower voltage(140 V),low
NVM(9.41 %) and low conductivity(960 ms) , I am getting high
thickness(26-32 microns). Let me reduce the temperature to 25 Deg C
and then see what happens. Thx again for ur suggestion.
Regards,
Manish C [name deleted for privacy]
- New Delhi, India
+++
If you are unable to control the thickness, the problem may lie
elsewhere. You need to check if the voltage displayed is the same as
the voltage applied on the component.
+++
Dear friend,
In my opinion may the conductivity of ED bath is too low. Because
I have the opposite problems from you. Since I want to raise the
thickness (now is about 20 micron) but the only difference parameter
was conductivity of ED Bath whereas too high in mine.
The data parameter from my process are :
1.NV 14.67%
2.Coating voltage is 140 V (range 80 to 160 V)
3.pH is 6.25 (range from 5.9 to 6.3)
4.Conductivity is about 1545 micro Siemens/cm. (standard is 1100 to
1400).
5.Ratio F1 to F2 is 1:10
I also used the latest technology of ED Paint, which is Acrylic
CED-Lead Free
Henry S [name deleted for privacy]
- Jakarta, Indonesia
+++++
Hello sirs I humbly feel that it's really a great time to interact
with you wizards. in our CED process , we r encountering a major
paint problem poor E'coat deposition(dipping process) defect in the
sill outer panel of the car body because of " rust " in the
non-coverage area of coating . this is not occurring in the sill
outer panels we use which are provided with wax holes.
I'm really baffled whether the problem is with the process parameter
settings or the mechanical alignment or settings .
the process parameters settings we use in our CED process are :
%NVM = 18.7
pH = 5.94
CONDUCTIVITY = 1827 uS
P/B RATIO = 0.16-0.25
BATH TEMPERATURE = 30.7
APPLIED VOLTAGE = INLET POINT = 0 V
OUTLET VOLTAGE = 100 V
MAIN BUS = 235 V
CURRENT = INLET = 0/350 amps
MAIN = 950 amps
when we change the inlet voltage , paint defect" hash marks" start
appearing in the car bodies . we r planning to increase the %NVM or
the inlet voltage , WILL IT SOLVE THE PROBLEM !!!!!!
generously give me ur valuable suggestions .
looking forward with great regards ,
C Nanda K [name deleted for privacy]
- Chennai, India
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July 21, 2007
Dear Mr.Manish,
I understand your problem.
You want to control the outer DFT without disturbing any
line condition.
In this case you can cover the anode cells simply with the
PVC pipe of good quality (Quality in the sense of Good
Chemical Resistance).
After doing this definitely you will get reduction of 6 to 8
µ DFT.
Your throw power will not affect after doing this (Kindly
check up with the paint supplier).
regards,
Amar Koppa
paints - Pune
May 23, 2008
Dear Manish,
One other way of reducing the DFT of your EDP is in choosing
mineral fillers with a very fine particle size, good
dispersion properties and good flow properties. It often
happens that due to cost reasons, producers change the
mineral filler included in the original formulation to a
cheaper grade locally available. In this case, many
properties of the EDP - including the DFT - are getting
worse.
Especially the dispersion behavior of the fillers affect the
DFT very much. If the filler is not dispersed properly, you
will find agglomerates that are actually much larger than
the original particle size of the filler. Also the flow
properties are affected negatively by a bad
dispersion.
There are only very few mineral fillers that are working
properly in EDP systems, one I know is called
Sillitin.
Best Regards
Christian
Christian Plein
- Neuburg, Germany
June 29, 2008
Dear Manish,
I feel sorry to say that the CED you are using have very low
repture limit.Generally repture limit of CED is more the
equel to 350 volt. No body can help you just change the
paint suplier.
Alam Farrukh
- Lahore Pakistan
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