Letter 23046

Solder delamination

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Dear everyone, My job is on product development but my inquiry is related to product reliability. Our products are on power devices i.e. MOSFETs, TOPFETs, and I would like to ask if what exactly causes solder delamination after exposing them to reliability tests like thermal fatigue and temperature cycling tests up to 1000 cycles. What are other issues of the solder delamination? The solder we are using by the way is PbSn5Ag1.5. I would really appreciate for anyone who could discuss thoroughly this subject. Thank you.

Jeffrey T. Dellosa
- Cabuyao, Laguna, Philippines

If you are plating solder over nickel, your delamination could be caused by the following: oxides nickel (too long after nickel plate before solder plate), a brite or contaminated nickel bath (carbon treat nickel bath), or power supply interruption in any bath.

Karl Weyermann
- Lebanon, KY, USA

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