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Letter 19077
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Trevor Crichton |
James,
Your right. Using SD(sulphur depolarized)nickel and regular electronickel in the same basket is not good practice. The SD will dissolve preferentially and could cause uneven current distribution.
A few years ago I did a test using electrolytic cobalt as an anode in a bath of cobalt sulphate with no chlorides and the cobalt anode corroded fine so there would be no need for SD cobalt. That said, I think it would be difficult to get the anode ratio between nickel and cobalt right to get the desired alloy composition. I don't know that this could be calculated, it may require plain old trial and error.
Don Piett
- Canada
I ran a cobalt line with chloride and electrolytic cobalt chips and plated 0.005 with no adhesion problem. But, electroforming is usually done from a sulfamate bath. Normally you are looking for an extremely low internal stress. Henry has not given us enough to really give him an answer. He may find an answer in literature. I do remember an article or two about 15 years ago. Alloy deposition is no piece of cake.
James Watts
- Navarre, Florida
Cobalt will ALWAYS plate out faster than nickel. Cobalt plates out faster at lower current densities. Establishing a "balance" is probably impossible and definitely a life long R&D; program. Best advice, first question the accuracy of the interpretation of your instrument analysis that separates cobalt and nickel, then always be prepared to add Cobalt as concentrated Cobalt Sulfamate (and have it reliably analysed to separate nickel from cobalt).
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Robert H Probert Editor's
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