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Letter 15073
Thermal alumina growth data
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I am currently doing microfabrication research, and we are working
on a plasma etching process that uses an Aluminum layer as the etch
mask (etching SiO2). The Aluminum layer is eroding during the etch,
and completion of the etch is difficult due to loss of the mask
integrity. We are investigating ways of 'hardening' the mask layer.
The mask layer is only about 1µm thick.
During these types of etching processes, the natural oxide that
forms on the aluminum usually serves to slow the mask erosion. We
were wondering about increasing the thickness of this alumina layer
to increase the erosion resistance. Specifically, using thermal
alumina growth in an oxygen environment. I have spent some time
trying to find data showing aluminum oxide thickness vs. time at
different temperatures, but haven't found anything particularly
useful.
Because this is an issue related to aluminum anodization, I
thought that this might reach someone with the information or a good
reference for the information. I am not sure anodization would work
for us, because the acids could adversely affect other materials, the
potentials used might adversely affect IC electronics, and the
aluminum needs to be used after processing for electrical contact.
(We can work with a thin Al2O3 layer, but probably not a thick
anodized layer).
Any advice or references would be greatly appreciated.
Nicholas Jankowski
University of Virginia, Electrical Engineering - Charlottesville, VA,
USA
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Nicholas,
Some time has gone by and there has been no response to your
question. You are attending a college that is well known for its
semiconductor fabrication research. I assume you have exhausted all
of the resources at UVa? If not, you might find someone in Tom
Crowe's group (in the Applied Electrophysics Lab) who would be able
to help. They have been fabricating high frequency microwave
semiconductor devices for decades and may have some insight into the
problem you are attempting to solve. They have fabricated many
unusual and innovative devices over the years.
Sometimes the answer can be found very close to home.
There are many other research groups associated with UVa. I would
be very surprised if you can't find one that could give you some
advice.
Ronna Erickson
Radio Astronomy, Univ. of Massachusetts - Amherst, MA
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Acutally, I work in the Applied ElectroPhysics Lab :) Yes, I have
been in touch with some people in his group. They have done some work
with aluminum dioxide pirmarily with respect to tunnel junctions. The
main problem seems to be that (and I've come across this in the
literature quite a bit as well) they are dealing with extremely thin
aluminum films, and native oxidation at room temperature is usually
more than enough to completely oxidize the films they're working
with. So, its not quite applicable to what I'm looking at.
Nicholas Jankowski
University of Virginia, Electrical Engineering - Charlottesville, VA,
USA
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