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Letter 15029
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Tom Pullizzi |
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I don't like to use the words direct and reverse, however, what you are doing makes good adhesion, Make the part CATHODIC in the clean electronic grade sulfuric acid using bagged carbon anodes. Be aware that any sulfuric soluble impurities (iron, copper, zinc,) either coming in with the sulfuric acid or dragged in by you, will co-deposit but not adhere over old nickel oxide, and then your deposit will blister off. Also the addition of about 1/2 oz/gal very clean and pure ammonium bifluoride will enhance the adhesion. Any metallic impurities will compromise this process, and it will also compromise a Sulfamate strike or a Woods Strike. Theoretically the only difference in the results from electrolytic plain acid versus a metallic strike is that NOW you must transfer to the plating tank more rapidly.
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Robert H Probert Editor's
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I am aware of the fact that cyanide sounds like a four letter word but in case that you have cyanide in your premises, a cathodic activation in an alkaline cyanide solution is the best way to activate nickel and to enable plating nickel on nickel. If you stick to the sulfuric acid activation, use the previous reply and add fluorides. I recommend to activate in the sulfuric acid only when parts are activated cathodically.(what you call direct).
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Hi, we run a Pulse Reverse Nickel chloride process. We are able to run reverse for e.g. 5 min. and then start up the electroforming process, without the item leaving the bath. This could solve all your problems.
Lars B. Andersen
- Denmark
Thank you very much Tom, Robert, Sara and Lars for your comments. The part is already plated and everything has gone OK. It was 1 piece, 8 tons, but only 1 piece. The sulfuric was as clean as possible and the dead time was as short as we could.
Thanks again,
Angel Vidal
- Spain

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